High Speed VLSI Interconnections

This book PDF is perfect for those who love Technology & Engineering genre, written by Ashok K. Goel and published by John Wiley & Sons which was released on 19 October 2007 with total hardcover pages 432. You could read this book directly on your devices with pdf, epub and kindle format, check detail and related High Speed VLSI Interconnections books below.

High Speed VLSI Interconnections
Author : Ashok K. Goel
File Size : 43,5 Mb
Publisher : John Wiley & Sons
Language : English
Release Date : 19 October 2007
ISBN : 0470165960
Pages : 432 pages
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High Speed VLSI Interconnections by Ashok K. Goel Book PDF Summary

This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.

High Speed VLSI Interconnections

This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology

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