Micro and Nanoscale Laser Processing of Hard Brittle Materials

This book PDF is perfect for those who love Technology & Engineering genre, written by Jiwang Yan and published by Elsevier which was released on 12 November 2019 with total hardcover pages 242. You could read this book directly on your devices with pdf, epub and kindle format, check detail and related Micro and Nanoscale Laser Processing of Hard Brittle Materials books below.

Micro and Nanoscale Laser Processing of Hard Brittle Materials
Author : Jiwang Yan
File Size : 51,6 Mb
Publisher : Elsevier
Language : English
Release Date : 12 November 2019
ISBN : 9780128168806
Pages : 242 pages
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Micro and Nanoscale Laser Processing of Hard Brittle Materials by Jiwang Yan Book PDF Summary

Micro and Nanoscale Laser Processing of Hard Brittle Materials examines general laser-material interactions within this type of material, focusing on the nanoprocessing technologies that these phenomena have given rise to. Sections cover laser machining, healing, recovery, sintering, surface modification, texturing and microstructuring. These technologies all benefit from the characteristics of laser processing, its highly localized heating ability, and its well-defined optical properties. The book also describes frontier applications of the developed technologies, thus further emphasizing the possibility of processing hard brittle materials into complex structures with functional surfaces at both the micro and nanoscale. Provides readers with a solid understanding of laser-material interactions Helps readers choose suitable laser parameters for processing hard brittle materials Demonstrates how micro and nanoscale laser processing can be used to machine brittle materials without fracture

Micro and Nanoscale Laser Processing of Hard Brittle Materials

Micro and Nanoscale Laser Processing of Hard Brittle Materials examines general laser-material interactions within this type of material, focusing on the nanoprocessing technologies that these phenomena have given rise to. Sections cover laser machining, healing, recovery, sintering, surface modification, texturing and microstructuring. These technologies all benefit from the characteristics of

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