Modeling Analysis Design and Tests for Electronics Packaging beyond Moore

This book PDF is perfect for those who love Technology & Engineering genre, written by Hengyun Zhang and published by Woodhead Publishing which was released on 22 November 2019 with total hardcover pages 434. You could read this book directly on your devices with pdf, epub and kindle format, check detail and related Modeling Analysis Design and Tests for Electronics Packaging beyond Moore books below.

Modeling  Analysis  Design  and Tests for Electronics Packaging beyond Moore
Author : Hengyun Zhang
File Size : 52,9 Mb
Publisher : Woodhead Publishing
Language : English
Release Date : 22 November 2019
ISBN : 9780081025338
Pages : 434 pages
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Modeling Analysis Design and Tests for Electronics Packaging beyond Moore by Hengyun Zhang Book PDF Summary

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design Provides multiphysics modeling and analysis techniques of electronic packaging

Modeling  Analysis  Design and Testing for Electronics Packaging Beyond Moore

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and

DOWNLOAD
Modeling  Analysis  Design  and Tests for Electronics Packaging beyond Moore

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and

DOWNLOAD
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