| Author | : YongAn Huang |
| File Size | : 43,7 Mb |
| Publisher | : Unknown |
| Language | : English |
| Release Date | : 25 April 2024 |
| ISBN | : 7030625056 |
| Pages | : 287 pages |
Modeling and Application of Flexible Electronics Packaging by YongAn Huang,Zhouping Yin,Xiaodong Wan
Download or read online Modeling and Application of Flexible Electronics Packaging written by YongAn Huang,Zhouping Yin,Xiaodong Wan, published by Unknown which was released on 2019. Get Modeling and Application of Flexible Electronics Packaging Books now! Available in PDF, ePub and Kindle.
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This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to
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Get BookThis book provides a comprehensive introduction to printed flexible electronics and their applications, including the basics of modern printing technologies, printable inks, performance characterization, device design, modeling, and fabrication processes. A wide range of materials used for printed flexible electronics are also covered in depth. Bridging the gap between the
Get BookThe book series 'Polymer Nano-, Micro- and Macrocomposites' provides complete and comprehensive information on all important aspects of polymer composite research and development, including, but not limited to synthesis, filler modification, modeling, characterization as well as application and commercialization issues. Each book focuses on a particular topic and gives a
Get BookAbout five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews
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