Reflow Soldering Processes

This book PDF is perfect for those who love Technology & Engineering genre, written by Ning-Cheng Lee and published by Newnes which was released on 11 January 2002 with total hardcover pages 282. You could read this book directly on your devices with pdf, epub and kindle format, check detail and related Reflow Soldering Processes books below.

Reflow Soldering Processes
Author : Ning-Cheng Lee
File Size : 52,6 Mb
Publisher : Newnes
Language : English
Release Date : 11 January 2002
ISBN : 9780750672184
Pages : 282 pages
Get Book

Reflow Soldering Processes by Ning-Cheng Lee Book PDF Summary

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

Reflow Soldering Processes

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well

Get Book
Reflow Soldering

Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special

Get Book
Principles of Reliable Soldering Techniques

Soldering, Though Being An Age Old Phenomenon, Is Still Perhaps A Difficult Subject To Understand, Due To Its Interdisciplinary Nature. In This Book, Efforts Have Been Made To Describe The Physical Theories Responsible For Making A Good Joint, The Chemical Actions During Its Formation And The Electrical, Thermal And Mechanical

Get Book
Lead Free Solder Interconnect Reliability

Download or read online Lead Free Solder Interconnect Reliability written by Dongkai Shangguan, published by ASM International which was released on 2005. Get Lead Free Solder Interconnect Reliability Books now! Available in PDF, ePub and Kindle.

Get Book
Mechanics of Solder Alloy Interconnects

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution

Get Book
Lead Free Soldering

The worldwide trend toward lead-free components and soldering is especially urgent in the European Union with the implementation strict new standards in July 2006, and with pending implementation of laws in China and California. This book provides a standard reference guide for engineers who must meet the new regulations, including a

Get Book
Brazing and Soldering 2012

Download or read online Brazing and Soldering 2012 written by Robbin Gourley, published by ASM International which was released on 2012. Get Brazing and Soldering 2012 Books now! Available in PDF, ePub and Kindle.

Get Book
Reflow Soldering Processes

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well

Get Book