Robust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture

This book PDF is perfect for those who love Technology & Engineering genre, written by E-H Wong and published by Woodhead Publishing which was released on 23 May 2015 with total hardcover pages 482. You could read this book directly on your devices with pdf, epub and kindle format, check detail and related Robust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture books below.

Robust Design of Microelectronics Assemblies Against Mechanical Shock  Temperature and Moisture
Author : E-H Wong
File Size : 52,8 Mb
Publisher : Woodhead Publishing
Language : English
Release Date : 23 May 2015
ISBN : 9780857099112
Pages : 482 pages
DOWNLOAD

Robust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture by E-H Wong Book PDF Summary

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study

Robust Design of Microelectronics Assemblies Against Mechanical Shock  Temperature and Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and

DOWNLOAD
Cyber Physical Systems  Design and Application for Industry 4 0

This book consists of chapters dedicated to the questions of cyber-physical system design and its usage for the chemical industry and new material design. Also, the contribution of the book covers scientific research and their results for cyber-physical systems design and application in the energy domain and solutions regarding engineering

DOWNLOAD
Solder Joint Reliability

Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive

DOWNLOAD
Plastic Packaging of Microelectronic Devices

Download or read online Plastic Packaging of Microelectronic Devices written by Louis T. Manzione, published by Van Nostrand Reinhold Company which was released on 1990. Get Plastic Packaging of Microelectronic Devices Books now! Available in PDF, ePub and Kindle.

DOWNLOAD
Optimum Cooling of Data Centers

This book describes the use of free air cooling to improve the efficiency of, and cooling of, equipment for use in telecom infrastructures. Discussed at length is the cooling of communication installation rooms such as data centers or base stations, and this is intended as a valuable tool for the

DOWNLOAD
Proceedings of the     International Symposium on Microelectronics

Download or read online Proceedings of the International Symposium on Microelectronics written by Anonim, published by Unknown which was released on 1997. Get Proceedings of the International Symposium on Microelectronics Books now! Available in PDF, ePub and Kindle.

DOWNLOAD
High Temperature Electronics

The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had

DOWNLOAD
Reflow Soldering Processes

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well

DOWNLOAD