Stress and Strain Engineering at Nanoscale in Semiconductor Devices

This book PDF is perfect for those who love Science genre, written by Chinmay K. Maiti and published by CRC Press which was released on 30 June 2021 with total hardcover pages 274. You could read this book directly on your devices with pdf, epub and kindle format, check detail and related Stress and Strain Engineering at Nanoscale in Semiconductor Devices books below.

Stress and Strain Engineering at Nanoscale in Semiconductor Devices
Author : Chinmay K. Maiti
File Size : 46,6 Mb
Publisher : CRC Press
Language : English
Release Date : 30 June 2021
ISBN : 9781000404937
Pages : 274 pages
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Stress and Strain Engineering at Nanoscale in Semiconductor Devices by Chinmay K. Maiti Book PDF Summary

Anticipating a limit to the continuous miniaturization (More-Moore), intense research efforts are being made to co-integrate various functionalities (More-than-Moore) in a single chip. Currently, strain engineering is the main technique used to enhance the performance of advanced semiconductor devices. Written from an engineering applications standpoint, this book encompasses broad areas of semiconductor devices involving the design, simulation, and analysis of Si, heterostructure silicongermanium (SiGe), and III-N compound semiconductor devices. The book provides the background and physical insight needed to understand the new and future developments in the technology CAD (TCAD) design at the nanoscale. Features Covers stressstrain engineering in semiconductor devices, such as FinFETs and III-V Nitride-based devices Includes comprehensive mobility model for strained substrates in global and local strain techniques and their implementation in device simulations Explains the development of strain/stress relationships and their effects on the band structures of strained substrates Uses design of experiments to find the optimum process conditions Illustrates the use of TCAD for modeling strain-engineered FinFETs for DC and AC performance predictions This book is for graduate students and researchers studying solid-state devices and materials, microelectronics, systems and controls, power electronics, nanomaterials, and electronic materials and devices.

Stress and Strain Engineering at Nanoscale in Semiconductor Devices

Anticipating a limit to the continuous miniaturization (More-Moore), intense research efforts are being made to co-integrate various functionalities (More-than-Moore) in a single chip. Currently, strain engineering is the main technique used to enhance the performance of advanced semiconductor devices. Written from an engineering applications standpoint, this book encompasses broad areas

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