Three dimensional Molded Interconnect Devices 3D MID

This book PDF is perfect for those who love Technology & Engineering genre, written by Jörg Franke and published by Hanser Pub Incorporated which was released on 06 December 2022 with total hardcover pages 356. You could read this book directly on your devices with pdf, epub and kindle format, check detail and related Three dimensional Molded Interconnect Devices 3D MID books below.

Three dimensional Molded Interconnect Devices  3D MID
Author : Jörg Franke
File Size : 55,5 Mb
Publisher : Hanser Pub Incorporated
Language : English
Release Date : 06 December 2022
ISBN : 1569905517
Pages : 356 pages
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Three dimensional Molded Interconnect Devices 3D MID by Jörg Franke Book PDF Summary

Three-dimensional molded interconnect devices (MID) enable mechanical, electronic, optical, thermal and fluidic functions to be integrated into injection-molded components. Function integration on this scale goes hand in hand with a high level of geometrical design freedom and opportunities for miniaturization, plus the associated reduction in weight and savings on product costs. MID are made primarily of recyclable thermoplastics, so they are more environmentally compatible than alternatives produced using other available technologies. MID are used in virtually every sector of electronics. The many standard applications for MID in the automotive industry in particular also drive for further development and research into MID technology. The significance of MID technology is also increasing in medical engineering, IT and telecommunications, and industrial automation with numerous applications now successfully implemented in all these various fields. This book offers a comprehensive insight into the state of the art in 3D-MID technology along the entire process chain. Individual chapters, moreover, deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.

Three dimensional Molded Interconnect Devices  3D MID

Three-dimensional molded interconnect devices (MID) enable mechanical, electronic, optical, thermal and fluidic functions to be integrated into injection-molded components. Function integration on this scale goes hand in hand with a high level of geometrical design freedom and opportunities for miniaturization, plus the associated reduction in weight and savings on product

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