| Author | : Andrea Chen |
| File Size | : 40,8 Mb |
| Publisher | : CRC Press |
| Language | : English |
| Release Date | : 19 April 2016 |
| ISBN | : 9781439862070 |
| Pages | : 216 pages |
Semiconductor Packaging by Andrea Chen Book PDF Summary
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
