3D IC Stacking Technology

This book PDF is perfect for those who love Technology & Engineering genre, written by Banqiu Wu and published by McGraw Hill Professional which was released on 14 October 2011 with total hardcover pages 544. You could read this book directly on your devices with pdf, epub and kindle format, check detail and related 3D IC Stacking Technology books below.

3D IC Stacking Technology
3D IC Stacking Technology
Author : Banqiu Wu
File Size : 40,8 Mb
Publisher : McGraw Hill Professional
Language : English
Release Date : 14 October 2011
ISBN : 9780071741965
Pages : 544 pages
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3D IC Stacking Technology by Banqiu Wu Book PDF Summary

The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology

3D IC Stacking Technology

3D IC Stacking Technology by Banqiu Wu,Ajay Kumar,Sesh Ramaswami

The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step.

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3D IC and RF SiPs Advanced Stacking and Planar Solutions for 5G Mobility

3D IC and RF SiPs Advanced Stacking and Planar Solutions for 5G Mobility by Lih-Tyng Hwang,Tzyy-Sheng Jason Horng

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as

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Three Dimensional System Integration

Three Dimensional System Integration by Antonis Papanikolaou,Dimitrios Soudris,Riko Radojcic

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful

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Handbook of 3D Integration Volume 1

Handbook of 3D Integration Volume 1 by Philip Garrou,Christopher Bower,Peter Ramm

The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer

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3D IC and RF SiPs Advanced Stacking and Planar Solutions for 5G Mobility

3D IC and RF SiPs Advanced Stacking and Planar Solutions for 5G Mobility by Lih-Tyng Hwang,Tzyy-Sheng Jason Horng

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as

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Wafer Level 3 D ICs Process Technology

Wafer Level 3 D ICs Process Technology by Chuan Seng Tan,Ronald J. Gutmann,L. Rafael Reif

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book

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Design for Test and Test Optimization Techniques for TSV based 3D Stacked ICs

Design for Test and Test Optimization Techniques for TSV based 3D Stacked ICs by Brandon Noia,Krishnendu Chakrabarty

This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from

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3D Integration in VLSI Circuits

3D Integration in VLSI Circuits by Katsuyuki Sakuma

Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges

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